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Er-Yb: Glass+Co:spinel

The microchip composite component, especially in the form of Er-Yb: Glass +Co: Spinel passively q-switched microchips have been used for 1.5um lasers in remote sensing, ranging and imaging applications due to their compact size and the incorporation of both the lasing material and q-switch into a monolithic element. The approach minimizes system complexity and system size, and maximizes efficiency. The Glass+Er-Yb: Glass is available in two-segment configurations with the optional inclusion of additional undoped Glass part.

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Features

ü  Innovative high-temperature bonding process for strong bonds

ü  Reduce thermal end-effects

ü  Compact size

ü  External surface coatings

 

Er-Yb: Glass + Co: Spinel

Dopant Type,   Concentration

Er,  1.0wt.%;   

Yb, 18wt. %

Cross Section

1.5mm×1.7mm

Er-Yb Length

3.2mm

Co:spinel Length

1.5mm

End-face   Configuration

Flat/Flat

Side Specifications

cut

Coating

s1:HR@1535nm+AR@940nm;

s2:   PR@1535nm

 

Glass+Er-Yb: Glass+Co:Spinel

Dopant Type,   Concentration

Er,  1.0wt.%;   

Yb, 18wt. %

Cross Section

1.5mm×1.7mm

Undoped length

2.5mm

Er-Yb Length

3.2mm

Co:spinel Length

1.5mm

End-face   Configuration

Flat/Flat

Side Specifications

cut

Coating

s1:HR@1535nm+AR@940nm;

s2:   PR@1535nm

pdf-icon.pngDatasheet_Composite Cystal Er-Yb Glass_Co Spinel

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