The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the Printed Circuit Board (PCB) industry.
the Laser Direct Imaging (LDI) technology is used for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time.LDI is a process of imaging circuitry pattern directly on the PCB without the use of a phototool. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern.
Usually, the laser used in the LDI generates the UV-Violet line, which is suitable for the commonly available photoresists. We provide 380nm-440nm diode lasers for LDI light sources.
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